Reed Semiconductor Completes $100 Million Funding Round
June 25, 2026Reed Semiconductor Introduces 150A Top-Side-Cooled Smart Power Stage for High-Density AI/HPC Applications
RS95F36T Top-side-Cooled 150A Smart Power Stage
Reed Semiconductor today announced the RS95F36, a 150A top-side-cooled Smart Power Stage (SPS) designed to address the increasing power density and thermal challenges of next-generation AI, HPC, GPU, CPU, and accelerator platforms. Featuring an industry-focused 6mm × 6mm TLGA top-side-cooled package, the RS95F36 enables efficient heat removal from the top of the device, making it well suited for high-density power architectures with advanced cold-plate and direct-to-package cooling solutions.
Key Features of the RS95F36
- 150A maximum output current and 80A TDC
- 3.5V to 8V input voltage range
- 6mm × 6mm TLGA top-side-cooled package
- Integrated high-side and low-side MOSFETs and gate drivers
- Integrated current and temperature sensing
- Up to 3MHz switching frequency with 5V VIN
- 3.3V tri-state PWM compatibility
- Integrated UVLO, overcurrent, and overtemperature protection
- Designed for scalable multiphase architectures supporting AI and high-performance processors
Scalable Multiphase Architecture
The RS95F36 can be paired with Reed Semiconductor’s multiphase controllers to create highly scalable voltage-regulator solutions with up to 40 truly interleaved phases, enabling precise current sharing and high power density.
This combination provides a flexible power platform for GPUs, CPUs, AI accelerators, ASICs, and other high-performance computing processors, helping system designers meet the rapidly increasing current demands of next-generation AI and data-center systems.
Learn more about how our products can elevate your applications by contact our sales team.
Thank you for choosing Reed Semiconductor for innovative power management solutions!
